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HE-860S Series
Half-size ISA Embedded VIA Eden CPU Card / Slot PC
Embedded VIA Eden 533 MHz CPU
Optional Fan Free Eden 400/800 MHz CPU
Optional Low Power C3 800/933 MHz CPU
VIA/Trident Blade3D VGA with 8MB VRAM
Optional TMDS DVI Interface
Onboard 10/100 Mbps LAN
Onboard AC97 3D Audio
Onboard DiskOnChip Socket
Selectable RS-422/485 Serial Port
ISA 64mA High Drive Capacity

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  Overview

肯茂HE-860S单板电脑,是一款基于VIA Eden /C3低功耗嵌入式平台而设计的,集多种功能的工业半长ISA总线CPU卡。基于ISA总线界面,通过工业底板,HE-860S提供了灵活的可扩展的ISA扩展口。1 Gbytes/秒的数据传输能力让HE-860的带宽几倍于NS Geode, Transmeta Crusoe, and Intel ULP Celeron based SBC 。另外VIA Eden平台,512 MB PC-133 SDRAM,集成3D SVGA 8MB VRAM10/100 Mbps LANUltraATA/100 IDE, AC97 3D音频,M-systems SSD接口和ISA 64mA high drive capacity,以上这些功能使HE-860S为您提供了最理想的嵌入式解决方案:

·     高级嵌入式计算平台:先进的686级的VIA Eden平台,533 MHz的主频133 MHz前端总线,提供了1 Gbytes/秒的数据传输速率。基于x86架构和威盛最新的技术,HE- 860S支持多种基于x86的操作系统和界面。也就是说,用HE–860S ,嵌入式系统可以轻松地集成和升级时下存在和流行的基于x86的软件。

·     超低功耗/无风扇方案:威盛Eden ESP处理器,采用了0.13微米的制作工艺,工作电压范围仅为1.05 to 1.2 V。先进的散热技术,使得HE-860S成为完美的小体积无风扇嵌入式系统

多功能综合解决方案:HE-860S整合了3D SVGA, 10/100 Mbps LAN, AC97 3D Audio, UltraATA/100 IDEDiskOnChip嵌入式固态闪存磁盘接口和ISA 64mA high drive capacity,为高端嵌入式应用功能,高速度,高集成,低功耗,无风扇,以及带嵌入式操作系统的闪存盘的全面嵌入式系统,提供了高度集成化的解决方案。

  Key Feature

  • Powerful embedded computing capacity with VIA Eden 533 MHz CPU at the same level as Intel Celeron and Pentium-III

  • High memory capacity up to 512 MB SDRAM

  • Flexible integrated PISA-bus interface with PCI/ISA expansive interfaces with industrial backplanes

  • Integrated 3D VGA interface with 8 MB of video memory, high performance of TMDS panel link solution supported

  • Integrated AC97 3D audio interface

  • Integrated 10/100 Mbps Fast Ethernet interface

  • Integrated UltraATA/100 PCI enhanced IDE interface for high performance of HDD and DiskOnModule embedded flash disk

  • ISA high drive capacity with enhanced 64mA on data and address bus. Drive capacity up to over 20 pieces of ISA-based add-on cards for CTI, VoIP or other applications with multiple ISA-based peripheral cards

  • Integrated Solid State Disk interface with M-systems DiskOnChip embedded flash disk

  • Popular OS supported for industrial mainstream applications

Specification

Form Factor
Half-size ISA-bus interface CPU card / SlotPC
CPU
Onboard VIA embedded Eden 533 MHz CPU @ 133 MHz FSB
Ultra low voltage for low power, FAN FREE application
Optional Eden 400/667/800 MHz CPU (fan free) for OEM
Optional C3 Ezra 800/933 MHz CPU (with onboard fan)  for OEM
Memory
One 168-pin DIMM socket up to 512 MBytes PC133 SDRAM
Chipset
VIA/Trident PLE133T chipset with 8601T and 686B
BIOS
Phoenix-Award D686 2Mb PnP flash BIOS
Watchdog Timer
6-level generates NMI or system reset watchdog timer
Power Management
ACPI 1.0 compliant, supports power saving mode with ATX PSU
Real Time Clock
VIA 686B integrated RTC with onboard lithium battery
PCI Enhanced IDE
Dual UltraATA/100 bus master IDE channels
Support up to 4 ATAPI devices on dual 40-pin IDE ports
Jumper selectable Vcc power output on IDE2 for power cable free
DOM (DiskOnModule) flash disk
VGA Interface
VIA/Trident PLE133T chipset built-in Trident Blade3D SVGA core
Video memory up to 8 MBytes shared with system
Optional onboard TMDS DVI interface
LAN Interface
Onboard PCI RTL8100B Fast Ethernet chipset 
10/100Base-TX auto-switching, IEEE802.3U compliant
External RJ45 LAN connector with LED on bracket
Audio Interface
AC97 3D audio interface with line-in, line-out, Mic-in, CD-in
Multi-I/O Port
VIA 686B chipset built-in super-I/O controller
1 x RS-232 and 1 x RS-232/422/485 serial port
Jumper selectable +5V/+12V power output on RS232 mode 
1 x SPP/EPP/ECP bi-direction parallel port
2 x USB ports with USB 1.1 compliant
IrDA port, floppy port, AT, PS/2 keyboard and mouse port
Solid State Disk
(DiskOnChip)
M-systems DiskOnChip socket supports DiskOnChip2000
32-pin DIP JEDEC single chip flash disk 
Flash memory capacity up to 1 GBytes with ECC / EDC
8 KBytes of memory window
Expansive Interface
PC/104 embedded ISA-based interface
ISA golden finger with 8-/16-bit ISA bus interface
ISA 64mA high drive capacity on ISA expansive interface
Environment
Power Requirement: +5V and +12V (5Vsb for ATX mode)
Board Dimension: 185 x 122 mm (L x W)
Operation Temperature: 0 ~ 60oC (32 ~ 140oF)

Download datasheet @ PDF format

  Ordering Guide

 

HE-860SVL

Half-size ISA-bus Embedded VIA Eden CPU Card

with Embedded VIA Eden 533 MHz CPU, 3D SVGA, 10/100 Mbps LAN, AC97 3C Audio, UltraATA/100 IDE, DiskOnChip Interfaces and ISA 64mA High Drive Capacity

HE-860SVXL

Same as above but with TMDS Panel Link Interface

HE-860SCVL

(OEM Only)

Same as HE-860VL but with VIA Embedded C3 800 MHz CPU

with onboard CPU cooler with fan (Not Fan Free Solution) 

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