肯茂COMMELL CMB-573

CMB-573

Barebone support  Intel® Core™ 2 Duo mobile and 4 x LAN

　

||  Related Product  |  Datasheet  |  SBC (FS-961)  |  Mechanical Drawing  |  Chassis  ||

Overview

　肯茂CMB-573是一种结构紧凑型5.25"大小的多以太网嵌入式平台。采用Intel Core™ 2 Duo移动版处理器。配备有6个Intel 82574L千兆以太网接口，提供工业多以太网的应用如：防火墙，主流的IDS/IPS ，Anti-virus，VPN网关和UTM的应用。

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Features

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Form Factor  5.25" Barebone
Construction  Heavy-duty Steel
5.25" SBC  Inside Motherboard can be :

 LS-573TXD : support Intel® Core™ 2 Duo mobile in Socket P
Drive Bay

 1 x 2.5" HDD Space 
Riser card  No
Thermal Control  1 x System Fan
Front Panel  Power On/Off , reset and HDD activity LED
Rear Side I/O

 6 x RJ45 LAN, 1 x DC input, 6 x COM, 4 x USB, 1 x VGA, 1 x LPT

 1 x Key/Mouse, Line-In / Mic-In / Line-Out, 1 x Antenna, 1 x DVI
Environment  Operating Temperature: 0 ~ 40°C
Power supply  DC 12V input
Dimension  250 x 65 x 160 mm (W x H x D)
Weight  Approx. 1.75 kg , (Without HDD )

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Ordering Guide
 

CMB-573

 Barebone with LS-573TXD and SPD-080-12 12V/80W adapter

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